Hodgson Sealants has released the latest addition to its innovative new HY-SPEC range, HS50. A combination of quick grab, excellent tooling properties, and retained flexibility makes HS50 the perfect sealant for sealing and bonding joints in many fast-paced production settings. Hodgson HS50 is neutral cure, high modulus, solvent free adhesive based on Hodgson’s HY-SPEC technology. […]